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Editorial Board

Editor-in-Chief

  • Tong-Yi Zhang
    zhangty@hit.edu.cn
    School of Materials Science and Engineering, Harbin Institute of Technology, Shenzhen, Guangdong, China.
    Materials Genome Institute, Shanghai University, Shanghai, China.

Executive Editor

  • Xing-Jun Liu
    School of Materials Science and Engineering and Institute of Materials Genome and Big Data, Harbin Institute of Technology, Shenzhen, Guangdong, China.

Advisory Editors

  • Li-Quan Chen
    Beijing Advanced Innovation Center for Materials Genome Engineering, Key Laboratory for Renewable Energy, Beijing Key Laboratory for New Energy Materials and Devices, Institute of Physics, Chinese Academy of Sciences, Beijing, China.
  • Hua-Jian Gao
    School of Engineering, Brown University, Providence, Rhode Island, United States.
  • Peter W. Voorhees
    Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois, United States.

Associate Editors

  • Long-Qing Chen
    Department of Materials Science and Engineering, The Pennsylvania State University, University Park, State College, United States.
  • Xiang-Dong Ding
    State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an, Shaanxi, China.
  • Chuang Dong
    Key Laboratory of Materials Modification by Laser, Ion and Electron Beams (Ministry of Education), School of Materials Science and Engineering, Dalian University of Technology, Dalian, Liaoning, China.
  • Yong Du
    State Key Laboratory of Powder Metallurgy, Central South University, Changsha, Hunan, China.
  • Qing Jiang
    Key Laboratory of Automobile Materials, Department of Materials Science and Engineering, Jilin University, Changchun, Jilin, China.
  • Zi-Kui Liu
    Department of Materials Science and Engineering, The Pennsylvania State University, University Park, Pennsylvania, United States.
  • Feng Pan
    School of Advanced Materials, Peking University, Shenzhen Graduate School, Shenzhen, Guangdong, China.
  • David J. Srolovitz
    Department of Materials Science and Engineering, City University of Hong Kong, Hong Kong, China.
  • Yan-Jing Su
    Institute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing, China.
  • Hong Wang
    National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiaotong University, Shanghai, China.
  • Yun-Zhi Wang
    Department of Materials Science and Engineering, The Ohio State University, Columbus, Ohio, United States.
  • Xiao-Dong Xiang
    Department of Material Science and Engineering, Southern University of Science and Technology, Shenzhen, Guangdong, China.
  • Ji-Cheng Zhao
    Department of Materials Science and Engineering, University of Maryland, College Park, Maryland, United States.
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